LED Packaging Substrate
Common specifications:
15-80 microns
Application scenario:
LED packaging, chip packaging
Product features:
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Process Capability |
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Type |
Index |
Standard Index |
Special Index |
|
Substrate |
Substrate thickness |
0.38~1.0mm |
Min:0.15mm Max:2.0mm |
|
Overall dimension range |
114*114mm 120*120mm |
Min:50.8*50.8mm Max:138*190mm |
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|
Hole |
Control tolerance of tooling hole |
±50um |
Min:±20um |
|
Via hole aperture (according to aspect ratio) |
≥100um |
Min:40um |
|
|
Hole spacing |
≥300um ( 3 times aperture） |
Min:80um |
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Via hole distance to copper edge |
≥70um |
Min：50um |
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|
Circuit |
Conductor Width |
≥80um |
Min:40um |
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Conductor Spacing |
≥80um |
Min:40um |
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Tolerance Range |
≥±25um |
Min:±10um |
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|
Appearance |
Appearance tolerance |
±100um |
Min:±50um |
|
●Customization can be specifically communicated. |
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PIC: Jingle (Mr.)
Mail : jinyuequan@sinocera.cn
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