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Power laser LD

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Number of views:
1000
Product serial number
Contact:
Mr.Xia Mr.Tai Mr.Yu
Tel:
15905625858(Xia) 13956252958(Tai) 13965216788(Yu)
E-mail:
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0
Product description
Parameters

Common specifications:
15-80 microns
Application scenario:
Laser lighting, laser projection/display, optical communication, drones, gesture recognition for 3D sensing, laser radar for 3D sensing
Product features:
The LD chip has a small size and high power density, requiring good thermal conductivity of aluminum nitride substrate (>220W/mK);
So far, China is completely dependent on imports (such as Kyocera from Japan and Germany), with domestic substitution;
Laser chip mounting requires high graphics accuracy, roughness, flatness, and verticality;
AuSn alloy is preset, with a melting temperature of>290 ℃ and a suitable welding temperature of 310-330 ℃.
Comparison with imported products (4.5 × 5.75mm, 35W) performance test comparison, almost no difference.

 

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