Power laser LD
Common specifications:
15-80 microns
Application scenario:
Laser lighting, laser projection/display, optical communication, drones, gesture recognition for 3D sensing, laser radar for 3D sensing
Product features:
The LD chip has a small size and high power density, requiring good thermal conductivity of aluminum nitride substrate (>220W/mK);
So far, China is completely dependent on imports (such as Kyocera from Japan and Germany), with domestic substitution;
Laser chip mounting requires high graphics accuracy, roughness, flatness, and verticality;
AuSn alloy is preset, with a melting temperature of>290 ℃ and a suitable welding temperature of 310-330 ℃.
Comparison with imported products (4.5 × 5.75mm, 35W) performance test comparison, almost no difference.
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Mail Box: jinyuequan@sinocera.cn
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