Semiconductor cooling substrate TEC
Common specifications:
1-20 microns
Application scenario:
Optical communication/temperature control, optoelectronic devices/heat dissipation, insulation box, thermoelectric refrigerator, thermoelectric power generation, etc
Product features:
Optimize the process flow, shorten the manufacturing process and production cycle, and deliver in bulk;
Ultra thin aluminum nitride substrate (0.15mm), product copper thickness uniformity ± 5um
The metal side is fully wrapped to ensure reliability;
Laser resistance welding technology, efficient and reliable;
Local gold layer thickening, suitable for resistance welding and wire bonding.
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Marketing: MR. Jingle
Mail Box: jinyuequan@sinocera.cn
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