Thermal Interface Materials
Product description：
Thermal interface materials are a type of material applied between electronic components and heat dissipation devices. By eliminating the air between the device interfaces, the heat transfer efficiency between electronic components and heat sinks is improved, and the heat generated during the operation of electronic devices is evenly dispersed, thereby improving operational efficiency and life.
Product specifications：
1) Conventional Thermal Gap Filler
| Properties | units | GF-10 | GF-20 | GF-30 | GF-50 | GF-70 | GF-80 | GF-90 | GF-100 | Test Method |
| Thickness Range | mm | 0.5-10.0 | 0.5-2.0 | ASTM D374 | ||||||
| Thermal Conductivity |
W/m·K | 1 | 2 | 3 | 5 | 7 | 8 | 9 | 10 | Hot Disk |
| Thermal Impedance |
℃·in2/W（20psi,1mm） | 1.176 | 0.649 | 0.521 | 0.293 | 0.251 | 0.211 | 0.189 | 0.161 | ASTM D5470 |
| Hardness | Shore OO | 45-90 | ASTM D2240 | |||||||
| Breakdown Voltage | kV/mm AC | ＞6 | ASTM D149 | |||||||
2) Ultra-Soft Thermal Gap Filler
| Properties | units | GF-10S | GF-20S | GF-30S | GF-50S | GF-70S | Test Method |
| Thickness Range | mm | 0.5-1.0 | 0.5-1.0 | 0.5-1.0 | 0.5-1.0 | 0.5-1.0 | ASTM D374 |
| Therma Conductivityl |
W/m·K | 1 | 2 | 3 | 5 | 7 | Hot Disk |
| Thermal Impedance |
℃·in2/W（20psi,1mm） | 4 | 1.2 | 0.6 | 0.268 | 0.189 | ASTM D5470 |
| Hardness | Shore OO | 30-40 | 40 | ASTM D2240 | |||
| Breakdown Voltage | kV/mm AC | ＞6 | ASTM D149 | ||||
3) Ultra-Thin Thermal Gap Filler
| Properties | units | GF-50TH | GF-70TH | GF-80TH | Test Method |
| Color | - | Grey | / | ||
| Thickness Range | mm | 0.12-0.3 | ASTM D374 | ||
| Thermal Conductivity |
W/m·K | 5 | 7 | 8 | Hot Disk |
| Thermal Impedance |
℃·in2/W（20psi,0.12mm） | 0.128 | 0.08 | 0.08 | ASTM D5470 |
| Hardness | Shore OO | 80-90 | ASTM D2240 | ||
| Breakdown Voltage | kV/mm AC | ＞6 | ASTM D149 | ||
Production Base:
Sinocera No.6 Factory
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PIC: Jingle (Mr.)
Mail : jinyuequan@sinocera.cn
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