Titanium Dioxide Material
Product Category: Electronic Materials-High Frequency Copper Clad Laminate Filling Material-Titanium Dioxide Material
Product introduction: Electronic filling material is one of the main raw materials for copper-clad laminate (CCL). Serving as a substrate material for printed circuit boards, CCL plays the role of interconnecting conduction, insulation and support for printed circuit boards, and is widely used in various fields like computesr, communications and consumer electronics. The rapid development of 5G technology and automotive self-driving technology in recent years has put forward technical requirements for copper-clad laminates with high dielectric and low loss properties. We are committed to providing filling material solutions for high-performance copper-clad laminates, and have developed titanium dioxide filling materials that not only have the dielectric properties of high dielectric constant and low dielectric loss, but also have two different morphologies, spherical and angular, catering to the requirements of different manufacturing processes (including calendering, coating, rotary cutting, etc.).
Product Specifications：
| Item | STO series | QTO series | SST series | QST series | Method |
| SSA<m2/g> | 0.30-8.5 | 0.05-0.5 | 0.3-2.5 | 0.05-0.5 | BET |
| Average particle size<µm> | 0.2-10 | 5-25 | 1-10 | 5-25 | SEM |
| Crystaiiine phase | Rutile | Rutile | \ | \ | XRD |
| Dielectric constant after recombination | 3.00, 6.15, 10.20 ect | 3.00, 6.15, 10.20 ect dielectric and higher | Testing Conditions: 25℃@10GHz |
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| Dielectric loss after recombination | ＜1.0E-3 | ＜1.0E-3 | |||
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PIC: Jingle (Mr.)
Mail : jinyuequan@sinocera.cn
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