Electronic Paste
Product Introduction:
Electronic paste is an essential material in electronic component manufacturing, renowned for its pivotal role in packaging, electrode formation, and interconnectivity. It is synonymous with quality, efficiency, and cutting-edge technology. This material finds extensive applications across various sectors, including resistors, inductors, other passive components, microwave devices, piezoelectric ceramics, PTC components, sensors, printed circuits, touch screens, and automotive glass. Leveraging core innovations in nano powder surface treatment and ultra-fine powder dispersion, our production line includes MLCC nickel, silver-palladium, and copper termination electrode pastes, as well as epoxy resin silver paste. These products are celebrated for their stability, printability, consistent electrode performance, superior capacitance, high packing density, low-temperature processing, and outstanding flexibility and adhesion.
Product Specifications:
Nickel Paste
Temperature characteristics | Code | Powder size | Characteristic | Printing method | Application | Dry film density g/cm3 | ||||
Inorganic solids content % | 25℃ Viscosity(Pa·S) | Roughness(μm) | ||||||||
10rpm | 100rpm | Ra | Rz | |||||||
X5R/X7R | N2001 | 0.4μm | 54-58 | 12-20 | 8-12 | 0.05±0.01 | 0.5±0.1 | Screen printing | 3B104 | 5.3-6.0 |
N2022 | 0.3μm | 54-58 | 14-24 | 8-12 | 0.04±0.01 | 0.4±0.10 | 1R104、2R105 | |||
N2158 | 0.3μm | 54-58 | 14-24 | 8-12 | 0.035±0.01 | 0.35±0.10 | 2B104/3B105 Automotive products | |||
N2024 | 0.2μm | 54-58 | 14-20 | 6-10 | 0.03±0.01 | 0.3±0.1 | 2R475/3R106 | |||
N2018 | 0.18 um | 54-58 | 12-28 | 5-9 | 0.025±0.01 | 0.25±0.1 | 3R226 | |||
N2015 | 0.15μm | 53-57 | 12-28 | 5-9 | 0.025±0.01 | 0.25±0.05 | 1R105 | |||
GN2174 | 0.3μm | 57-61 | 0.8-1.3 | 0.5-0.8 | 0.04±0.01 | 0.40±0.1 | Gravure printing | 5R106/2R105 | ||
GN2178 | 0.2μm | 57-61 | 1.0-1.5 | 0.4-0.8 | 0.025±0.01 | 0.3±0.1 | 2R475/3R106-6.3V | |||
GN2179 | 0.18μm | 57-61 | 1.0-1.5 | 0.4-0.8 | 0.025±0.01 | 0.25±0.1 | 3R226-10V | |||
NP0 | N3151 | 0.3μm | 54-58 | 18-25 | 9-4 | 0.04±0.01 | 0.4±0.1 | Screen printing | 2C100/101 | |
N3007 | 0.3μm | 54-58 | 12-18 | 6-9 | 0.04±0.01 | 0.4±0.1 | 6C104 | |||
N3047 | 0.3μm | 52-56 | 14-20 | 7-10 | 0.04±0.01 | 0.4±0.1 | 1210/333-630V2B104/3B105 Automotive products | |||
N3054 | 0.2μm | 54-58 | 18-25 | 8-13 | 0.03±0.01 | 0.3±0.1 | 1C100/101 |
Copper Paste
code |
C4025 |
C4096 |
C4041 |
C4037 |
C6119 |
|
Inorganic additions |
glass |
glass |
glass |
glass |
ceramics |
|
Inorganic solids content % |
80±3 |
80±3 |
80±3 |
80±3 |
54±1 |
|
Viscosity/Pa·s |
10rpm |
45±5 |
45±5 |
45±5 |
45±5 |
16±3 |
100rpm |
27±3 |
27±3 |
27±3 |
27±3 |
12±2 |
|
Sintering temperature(℃) |
800±20 |
750±20 |
760±20 |
780±20 |
/ |
|
MLCC application specifications |
0603/0805 NP0 |
0603/0805 X7R |
0201/0402 X7R |
020/0402 NP0 |
High frequency, high Q |
|
Sealing/printing thickness |
40-80um |
30-60um |
20-40um |
15-30um |
2-3um |
|
application type |
Termination Paste |
Inner paste |
||||
SEM(DPA) |
||||||
Silver Palladium Paste
INSPECTION ITEM |
UNIT |
A9115 |
A9118 |
|
1.Viscosity
(at 25℃,HADV-ΙΙ,SC4-14/6R) |
10rpm |
Pa·s |
30-40 |
30-40 |
100rpm |
Pa·s |
15-20 |
15-20 |
|
10 rpm/100rpm |
-- |
1.3-2.0 |
1.3-2.0 |
|
2. Solid content |
% |
53±2 |
53±2 |
|
3.Ag/Pd content |
% |
50±2 |
50±2 |
|
4.Ag/Pd ratio |
-- |
70/30 |
70/30 |
|
5. FOG-3 |
µm |
<7.5 |
<7.5 |
|
6. Type |
|
Class 1 porcelain |
Class 2 porcelain |
Silver Epoxy Paste SA0125
INSPECTION ITEM |
STANDARD |
RESULT |
UNIT |
|
1. Viscosity(at 25℃,HADV-ΙΙ,SC4-14/6R) |
1rpm |
60-90 |
70 |
Pa·s |
10rpm |
25-35 |
31 |
Pa·s |
|
100rpm |
13-18 |
15.2 |
Pa·s |
|
Thixotropic index 1 rpm/100rpm |
3.5-5.5 |
4.61 |
-- |
|
2. Solid content |
69-75 |
71.23 |
% |
|
3. F.O.G.(Main Break) |
<17.5 |
9 |
µ |
Production Base:
Company Address : 9# NORTH WAIHUAN ROAD, HUANGTANG 9# NORTH WAIHUAN ROAD, HUANGTANG JIANGYIN,CITY JIANGSU PROV. 214407 PRC
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Marketing: MR. Jingle
Mail Box: jinyuequan@sinocera.cn
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