Titania

     Product Introduction:

Electronic Filling Material is one of the main raw materials for making Copper Clad Laminate (CCL). As the substrate material of PCB (Printed Circuit Board), Copper-clad Laminate plays the significant role of interconnection, conduction, insulation and support for PCB. It is widely used in computers, communications, consumer electronics and other applications. In recent years, the rapid development of 5G and autonomous driving technology facilitates the technical requirements of high dielectric yet low loss for Copper Clad Laminate. We are committed to providing filling material solutions for high-performance CCL. The developed Titanium Dioxide filler not only has the dielectric properties of high dielectric constant and low dielectric loss, but also has spherical and angular morphological characteristics, which can meet the application requirements of different manufacturing processes. (including calender process, coating process, rotary cutting process, etc.)

Specification